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MPS-300-ICP—High Density Plasma
High-density tools offer the ability to produce a very reactive plasma with less radiation exposure to your substrate. Higher etch (or deposition) rates and lower processing temperatures are just two of the benefits of HDP's.
Our HDP system utilizes our basic RIE (or PECVD) platform and utilizes a patented, highly reliable, magnetically coupled plasma (MCP) source to produce high yield ion flux. MCP sources offer greater reliability over ECR sources due to our unique multi-coil design and by using lower frequencies.
Normally used for etching, it is also available in a deposition version and either are field retrofitable.
Si, SiO2, SiNx, Metals, TiW, GaAs, resist, ILD and polyimide, micromachining (MEMS), photonics, HTSC's, and for failure analysis
Target focusing electromagnets fine tune process uniformity
Mixed frequency and pulsed RF options for stress control
Safe, rugged design means high reliability with remarkable uptime. Easy to use and simple to service
Product Summary
Using our standard MPS platform, this Inductively Coupled Plasma (ICP) tool can be helpful where high etch rates and low damage are required. AGS utilizes a compact, self contained, economical HDP plasma source.
MPS-ICP Features
Modular Design for Ease of Maintenance
Single or Dual Chamber
Batch or Single Substrate
Small Foot Print
Stainless Steel or Aluminum Process Chambers
Cost Effective Process Solution
Automatic Process Controller using Windows®
MPS-XX0-PECVD available in 50-150, 200, & 300 mm versions
Manual load or a variety of vacuum load locks are available.
The MPS series is also available as an OEM module to integrate to existing system platforms
