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MPS-203-PVD—Physical Vapor Deposition
- High performance PVD at a low cost
- Al, Au, AlSi, Cu, AlCuSi metallization
- SiO2, SiNx, TaN, TiNx films Low temperature passivation and ILD films for III-V and HTSC compounds
- Configure as single or multi-target deposition tool
- DC or RF sputtering options available
- Safe, rugged design means high reliability with remarkable uptime
- Low hydrogen containing films assured by using residual stripping cryo pump
- Unique "Direct-Connect" construction is easy to service or upgrade
- Easy to use and simple to service
Product Summary
A versatile multi-process PVD tool with flexible controls and excellent uniformity - all for low price.
If you need reliability time after time when depositing low temperature films, the MPS Physical Vapor Deposition tool offers you the best value. Excellent process control and trouble-free operation can be yours.
MPS-PVD Features
Modular Design for Ease of Maintenance
Single or Dual Chamber
Batch or Single Substrate
Small Foot Print
Stainless Steel or Aluminum Process Chambers
Cost Effective Process Solution
Automatic Process Controller using Windows®
MPS-XX0-PVD available in 50-150, 200, & 300 mm versions
Manual load or a variety of vacuum load locks are available.
The MPS series is also available as an OEM module to integrate to existing system platforms.
