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NANO-MASTER’s Ion Beam Milling systems are very adaptable and can be built in various configurations depending on the application. A variety of sample holder and ion source configurations allow for a diverse range of applications. Sample holders used in the Ion Beam Milling systems have ±90° tilt, rotation, water cooling, and helium backside cooling. NANO-MASTER technology has demonstrated capability of keeping substrate temperatures below 50°C. By tilting and rotating trenches are beveled, and control over sidewall profile as well as radial uniformity is improved. Various options are available for different grid configurations and neutralizers. A sputtering option can be provided for coating freshly etched metal surfaces. Single wafer auto load and unload is also available.
Features
- Electropolished 14" SS cubical chamber
- Water cooled ±90° automatically tiltable rotating substrate holder
- MFC's
- DC ion sources 1cm-16cm
- ±1.2& etch uniformity across 6" substrate
- Capable of cooling substrates to <50°C
- 26" x 44" footprint with SS panels ideal for Class 100 cleanrooms
- Fully automated PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
- Spectroscopic end point detection
- Helium backside cooling
- Electropolished 21" SS cubical chamber
- Auto load/unload
- 1200 l/s turbomolecular pump
- Cryogenic pumping package
- Additional MFC's for reactive gases
- Gridded RFICP sources
- Hollow cathode or filament neutralization
- Sputtering source for passivation layer deposition
- III-V Photonics Components
- Laser Gratings
- High Aspect ratio etching of Photonics crystals
- Deep Trenches on SiO2, Si and metals
