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- Plasma Cleaning and Ashing Systems
Plasma Cleaning and Ashing Systems are designed to meet a wide range of needs from wafer resist stripping to surface modification of batch as single wafer loads. They are PC controlled systems with various plasma sources, heated and unheated substrate holders and unique ability to switch from plasma etch to RIE etch modes.
Features
- Stainless Steel, Aluminum or Bell Jar Chambers
- Class 100 cleanroom compatible
- Showerhead, ICP or microwave plasma sources
- Rotating platen
- 250 l/sec turbomolecular pump
- 5x10-7 Torr base pressure
- RF biasable heated up to 300°C PID controlled or cooled platen
- Fully automated or manual RF tuning
- Up to 4 MFC's with electropolished gas lines
- PC Controlled Pneumatic Valves
- Fully automated PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
Options
- Stainless Steel, Aluminum or Bell Jar Chambers
- Class 100 cleanroom compatible
- Showerhead, ICP or microwave plasma sources
- Rotating platen
- 250 l/sec turbomolecular pump
- 5x10-7 Torr base pressure
- RF biasable heated up to 300°C PID controlled or cooled platen
- Fully automated or manual RF tuning
- Up to 4 MFC's with electropolished gas lines
- PC Controlled Pneumatic Valves
- Fully automated PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
Applications
- Delayering for failure analysis
- Removal of organic and inorganic materials without residues
- Photoresist stripping or ashing
- Desmearing and etch back
- Cleaning microelectronics, drilled holes on circuit coards or Cu lead frames
- Adhesion promotion, elimination of bonding issues
- Surface modification of plastics: O2 treatment for paintability
- Producing hydrophilic or hydrophobic surfaces
