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- Single Wafer Wet Cleaning
Single Wafer Cleaners (SWC) focus on providing the best possible cleaning capability while maintaining affordability. A standard system is configured with clean, chemical clean, brush clean, high RPM spin dry with IR heating and N2 flow. Patented megasonic nozzle movement assures uniform delivery of megasonic energy; therefore, at any point on the surface, energy delivered can be kept below damage threshold
Features
- 12" OD, 7" x 7" substrates
- Table top unit
- Venturi powered vacuum
- Damage free megasonic
- Independent chemical dispenses
- Spin dry with heated N2
- Microprocessor controlled
- Chemical dispense unit
- Safety interlocks
- 19”x26” footprint
Options
- PVA brush cleaning (100 RPM)
- Post CMP brush cleaning (up to 400 RPM)
- Nitrogen ionizer
- CO2 inject with DIW resistivity monitor
- FM4910 Materials
Application
- Patterned and unpatterned masks and wafers
- Ge, GaAs and InP wafer cleaning
- Post CMP wafer cleaning
- Cleaning of diced chips on wafer frame
- Cleaning after plasma etch or photoresist stripping
- Mask blanks or contact mask cleaning
- Cleaning of X-ray and EUV masks
- Optical lens cleaning
- Cleaning of ITO coated display panels
- Megasonic assisted lift-off process
